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 RENESAS LSIs
M5M5V208AKV
2097152-BIT(262144-WORD BY 8-BIT)CMOS STATIC RAM
DESCRIPTION
The M5M5V208AKV is low voltage 2-Mbit static RAMs organized as 262,144-words by 8-bit, fabricated by high-performance 0.25m CMOS technology. The M5M5V208AKV is suitable for memory applications where a simple interfacing , battery operating and battery backup are the important design objectives. The M5M5V208AKV is packaged in 32-pin 8mm x 13.4mm sTSOP packages which is a high reliability and high density surface mount device.
PIN CONFIGURATION (TOP VIEW)
A11 A9 A8 A13 W S2 A15 VCC A17 A16 A14 A12 A7 A6 A5 A4
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
32 31 30 29 28 27 26
OE A10 S1 DQ8 DQ7 DQ6 DQ5 DQ4 GND DQ3 DQ2 DQ1 A0 A1 A2 A3
M5M5V208AKV
25 24 23 22 21 20 19 18 17
FEATURES
Access time (max)
Power supply current
Type name
Active (max)
stand-by (max)
M5M5V208AKV-55HI
55ns
35mA
(10MHz)
30A
(Vcc= 3.6V)
M5M5V208AKV-70HI
70ns
7mA
(1MHz)
0.3A
(Vcc= 3.0V TYPICAL)
Outline 32P3K-B(KV)
* Single 2.7 ~3.6V power supply * No clock, No refresh * Directly TTL compatible : All inputs and outputs * Easy memory expansion and power down by S1,S2 * Data hold on +2V power supply * Three-state outputs : OR - tie capability * OE prevents data contention in the I/O bus * Common data I/O * Package M5M5V208AKV ************* 32pin 8 X 13.4 mm
2
sTSOP
Rev ision-A0.5
1
RENESAS LSIs
M5M5V208AKV
2097152-BIT(262144-WORD BY 8-BIT)CMOS STATIC RAM
FUNCTION
The operation mode of the M5M5V208AKV series are determined by a combination of the device control inputs S1,S2,W and OE. Each mode is summarized in the function table. A write cycle is executed whenever the low level W overlaps with the low level S1 and the high level S2. The address must be set up before the write cycle and must be stable during the entire cycle. The data is latched into a cell on the trailing edge of W,S1 or S2,whichever occurs first,requiring the set-up and hold time relative to these edge to be maintained. The output enable input OE directly controls the output stage. Setting the OE at a high level, the output stage is in a highimpedance state, and the data bus contention problem in the write cycle is eliminated. A read cycle is executed by setting W at a high level and OE at a low level while S1 and S2 are in an active state(S1=L,S2=H). When setting S1 at a high level or S2 at a low level, the chip are in a non-selectable mode in which both reading and writing are disabled. In this mode, the output stage is in a high- impedance state, allowing ORtie with other chips and memory expansion by S1 and S2. The power supply current is reduced as low as the stand-by current which is specified as ICC3 or ICC4, and the memory data can be held at +2V power supply, enabling battery back-up operation during power failure or power-down operation in the non-selected mode.
FUNCTION TABLE
S1 X H L L L S2 L X H H H W X X L H H OE Mode DQ X Non selection High-impedance X Non selection High-impedance Din X Write Dout L Read High-impedance H ICC Stand-by Stand-by Active Active Active
Note 1: "H" and "L" in this table mean VIH and VIL, respectively. 2: "X" in this table should be "H" or "L".
BLOCK DIAGRAM
A2 18 A3 17 A4 16 A5 15 A6 14 A7 13 A12 12 A14 11 A16 10 A17 9
21 DQ1 22 DQ2
262144 WORDS X 8 BITS ( 1024 ROWS X256 COLUMNS X 8 BLOCKS )
23 DQ3 25 DQ4 26 DQ5 27 DQ6 28 DQ7 29 DQ8 DATA INPUTS/ OUTPUTS
ADDRESS INPUTS A15 A13 7 4
CLOCK GENERATOR
A8 3 A9 2 5 WRITE W CONTROL INPUT CHIP SELECT INPUTS
A11 1
A1 19 A0 20 A10 31
30 S1 6 S2
OUTPUT 32 OE ENABLE INPUT 8 24 VCC GND (0V)
Rev ision-A0.5
2
RENESAS LSIs
M5M5V208AKV
2097152-BIT(262144-WORD BY 8-BIT)CMOS STATIC RAM
ABSOLUTE MAXIMUM RATINGS
Symbol Vcc VI VO Pd Topr Tstg Supply voltage Input voltage Output voltage Power dissipation Operating temperature Storage temperature Parameter Conditions Ratings - 0.5*~4.6 - 0.5*~Vcc + 0.3 0~Vcc 700 - 40~85 - 65~150 Unit V V V mW C C
With respect to GND Ta=25C
* -3.0V in case of AC ( Pulse width 30ns )
DC ELECTRICAL CHARACTERISTICS (Ta= -40~85C, Vcc=2.7~3.6V, unless otherwise noted)
Symbol VIH VIL VOH1 VOH2 VOL II IO ICC1 Parameter High-level input voltage Low-level input voltage High-level output voltage 1 High-level output voltage 2 Low-level output voltage Input current Output current in off-state Active supply current (CMOS-level input) Active supply current (TTL-level input) IOH= - 0.5mA IOH= - 0.05mA IOL= 2mA VI=0~Vcc S1=VIH or S2=VIL or OE=VIH VI/O=0~VCC S1 0.2V,S2 Vcc-0.2V other inputs 0.2V or Vcc-0.2V, Output-open S1=VIL,S2=VIH, other inputs=VIH or VIL,Output-open 10MHz 1MHz 10MHz 1MHz ~25C ICC3 Stand-by current 1) S2 0.2V, other inputs=0 ~ VCC 2) S1 VCC - 0.2V, S2 VCC - 0.2V other inputs=0 ~ VCC ~40C ~70C ~85C ICC4 Stand-by current 1) S1=VIH, other inputs=VIL or VIH 2) S2=VIL, other inputs=VIL or VIH 28 5 33 5 0.3 Test conditions Limits Min 2.0 -0.3* 2.4 Vcc - 0.5 0.4 1 1 30 7 35 7 2 5 10 30 0.33 mA A mA mA Typ Max Vcc + 0.3 0.6 Unit V V V V V A A
ICC2
* -3.0V in case of AC ( Pulse width 30ns )
CAPACITANCE (Ta=- 40~85C, unless otherwise noted)
Symbol CI CO Parameter Input capacitance Output capacitance Test conditions VI=GND, VI=25mVrms, f=1MHz VO=GND,VO=25mVrms, f=1MHz Limits Typ Unit pF pF
Min
Max 8 10
Note 3: Direction for current flowing into an IC is positive (no mark). 4: T ypical value is Vcc = 3V, Ta = 25C
Rev ision-A0.5
3
RENESAS LSIs
M5M5V208AKV
2097152-BIT(262144-WORD BY 8-BIT)CMOS STATIC RAM
AC ELECTRICAL CHARACTERISTICS (Ta=- 40~85C, unless otherwise noted ) (1) MEASUREMENT CONDITIONS
VCC ................................. Input pulse level ............. ..... Input rise and fall time ............... Reference level Output loads................... 2.7~3.6V VIH=2.2V,VIL=0.4V 5ns VOH=VOL=1.5V Fig.1, CL=30pF CL=5pF (for ten,tdis) Transition is measured 500mV from steady state voltage. (for ten,tdis)
DQ CL including scope and JIG 1TTL
Fig.1 Output load
(2) READ CYCLE
Limits Symbol tCR ta(A) ta(S1) ta(S2) ta(OE) tdis(S1) tdis(S2) tdis(OE) ten(S1) ten(S2) ten(OE) tV(A) Read cycle time Address access time Chip select 1 access time Chip select 2 access time Output enable access time Output disable time after S1 high Output disable time after S2 low Output disable time after OE high Output enable time after S1 low Output enable time after S2 high Output enable time after OE low Data valid time after address Parameter -55HI Max Min 55 55 55 55 30 20 20 20 10 10 5 10 10 10 5 10 -70HI Max Min 70 70 70 70 35 25 25 25 Unit ns ns ns ns ns ns ns ns ns ns ns ns
(3) WRITE CYCLE
Symbol tCW tw(W) tsu(A) tsu(A-WH) tsu(S1) tsu(S2) tsu(D) th(D) trec(W) tdis(W) tdis(OE) ten(W) ten(OE) Parameter Write cycle time Write pulse width Address setup time Address setup time with respect to W Chip select 1 setup time Chip select 2 setup time Data setup time Data hold time Write recovery time Output disable time from W low Output disable time from OE high Output enable time from W high Output enable time from OE low Limits -70HI -55HI Min Max Min Max 55 45 0 50 50 50 25 0 0 20 20 5 5 5 5 70 55 0 65 65 65 30 0 0 25 25 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns
Rev ision-A0.5
4
RENESAS LSIs
M5M5V208AKV
2097152-BIT(262144-WORD BY 8-BIT)CMOS STATIC RAM
(4) TIMING DIAGRAMS Read cycle
tCR A0~17 ta(A) tv (A)
ta (S1) S1
(Note 5) (Note 5)
tdis (S1)
S2
(Note 5)
ta (S2) ta (OE) ten (OE) tdis (S2)
(Note 5)
OE
(Note 5)
tdis (OE) ten (S1) ten (S2)
(Note 5)
DQ1~8
W = "H" level
DATA VALID
Write cycle (W control mode)
tCW
A0~17
tsu (S1) S1
(Note 5) (Note 5)
S2
(Note 5)
tsu (S2)
(Note 5)
tsu (A-WH) OE
tsu (A) W
tw (W)
trec (W)
tdis (W) tdis (OE) DQ1~8 ten (W) DATA IN STABLE tsu (D) th (D)
ten(OE)
Rev ision-A0.5
5
RENESAS LSIs
M5M5V208AKV
2097152-BIT(262144-WORD BY 8-BIT)CMOS STATIC RAM
Write cycle ( S1 control mode)
tCW A0~17
tsu (A)
tsu (S1)
trec (W)
S1
S2
(Note 5) (Note 7) (Note 5)
W
(Note 6) (Note 5) (Note 5)
tsu (D) DATA IN STABLE
th (D)
DQ1~8
Write cycle (S2 control mode)
tCW A0~17
S1
(Note 5) (Note 5)
tsu (A) S2
tsu (S2)
trec (W)
(Note 7)
W
(Note 5)
(Note 6) (Note 5)
tsu (D) DATA IN STABLE
th (D)
DQ1~8
Note 5: Hatching indicates the state is "don't care". 6: Writing is executed while S2 high overlaps S1 and W low. 7: When the falling edge of W is simultaneously or prior to the falling edge of S1 or rising edge of S2, the outputs are maintained in the high impedance state. 8: Don't apply inverted phase signal externally when DQ pin is output mode.
Rev ision-A0.5
6
RENESAS LSIs
M5M5V208AKV
2097152-BIT(262144-WORD BY 8-BIT)CMOS STATIC RAM
POWER DOWN CHARACTERISTICS (1) ELECTRICAL CHARACTERISTICS (Ta= -40~85C, unless otherwise noted)
Symbol VCC (PD) VI (S1) VI (S2) Parameter Power down supply voltage Chip select input S1 Chip select input S2 VCC = 3.0V 1) S2 0.2V, other inputs = 0~Vcc 2) S1 VCC-0.2V, S2 VCC-0.2V, other inputs = 0~Vcc ~25C ~40C ~70C ~85C 0.3 Test conditions Min 2.0 2.0 Limits Typ Max Unit V V 0.2 1 3 8 24 A V
ICC (PD)
Power down supply current
(2) TIMING REQUIREMENTS (Ta=-40~85C, unless otherwise noted )
Symbol tsu (PD) trec (PD) Parameter Power down set up time Power down recovery time Test conditions Min 0 5 Limits Typ Max Unit ns ms
(3) POWER DOWN CHARACTERISTICS S1 control mode
VCC t su (PD) 2.7V 2.7V t rec (PD)
2.2V S1 S1 VCC - 0.2V
2.2V
Note 9: On the power down mode by controlling S 1,the input level of S2 must be S2 Vcc - 0.2V or S2 0.2V. The other pins(Address,I/O,WE,OE) can be in high impedance state.
S2 control mode
VCC 2.7V 2.7V t rec (PD)
S2
t su (PD)
0.2V
0.2V
S2 0.2V
Rev ision-A0.5
7
RENESAS LSIs
M5M5V208AKV
2097152-BIT(262144-WORD BY 8-BIT)CMOS STATIC RAM
Nippon Bldg.,6-2,Otemachi 2-chome,Chiyoda-ku,Tokyo,100-0004 Japan
Keep safety first in your circuit designs!
* Renesas T echnology Corporation puts the m axim um effort int o m a k ing sem iconductor products better and more reliable, but there is always the possibility that trouble m ay occur with them . T r o u b le with sem iconductors m ay lead to personal injury, fire or property dam age.Rem ember to give due consideration to safety when m aking your circuit designs, with appropriate m easures such as (i) placem ent of substit u t ive, auxiliary circuits, (ii) use of nonflam m able m aterial or (iii) prevention against any m alfunction or mishap.
Notes regarding these materials
* T hese m aterials are intended as a reference to assist our custom ers in the selection of the Renesas T echnology Corporation product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas T echnology Corporation or a third party. * Renesas T echnology Corporation assum es no responsibility for any dam age, or infringem ent of any third-party's rights, originat ing in the use of any product data, diagrams, charts, program s , a lgorit h m s , or circuit application exam ples contained in these m aterials . * A ll inf o r m a t ion contained in these m aterials , including product data, diagrams, charts, programs and algorithms represents inform ation on products at the tim e of publication of these m aterials, and are subject to change by Renesas T echnology Corporation without notice due to product im provem ents or other reasons. It is therefore recomm ended that custom ers contact Renesas T echnology Corporation or an authorized Renesas T echnology Corporation product distributor for the latest product inform ation before purchasing a product listed herein. T he inform ation described here m ay contain technical inaccuracies or typographical errors. Renesas T echnology Corporation assum es no responsibility for any dam age, liability, or other loss rising from t hese inaccuracies or errors. P lease also pay attention to inform ation published by Renesas T echnology Corporation by various m eans, including the Renesas T echnology Corporation S e m iconductor home page (http://www.renesas.com ). * When using any or all of the information contained in these m aterials , including product data, diagrams, charts, programs, and algorithm s , p lease be sure to evaluate all inform ation as a total system before m aking a final decision on the applicability of the inform ation and products. Renesas T echnology Corporation assum es no responsibility for any dam age, liability or other loss resulting from the inform ation contained herein. * Renesas T echnology Corporation sem iconductors are not designed or m anufactured for use in a device or system t hat is used under circumstances in which hum an life is potentially at stake. Please contact Renesas T echnology Corporation or an authorized Renesas T echnology Corporation product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, m edical, aerospace, nuclear, or undersea repeater use. * T he prior written approval of Renesas T echnology Corporation is necessary to reprint or reproduce in whole or in part these m aterials . * If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from t he Japanese governm ent and cannot be im ported into a country other than the approved destinat ion. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destinat ion is prohibited. * P lease contact Renesas T echnology Corporation for further details on these m aterials or the products contained therein.
REJ03C0104 (c) 2003 Renesas Technology Corp. New publication, effective Aug 2003. Specifications subject to change without notice
Rev ision-A0.5
8


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